Founded in August 1998, Boin GmbH develops software solutions for the
semiconductor industry and provides services such as the development of
complex mathematical algorithms. The company was started based on a business
plan which won 2nd prize in a business plan competition known as "StartUp".
This is a nation-wide competiton of business plans initiated by the german
magazine "Stern", the banking association Sparkasse, and the consultants
McKinsey & Company.
Boin GmbH´s focus is to develop advanced metrology software for the
semiconductor industry. The company continues to develop long-term
partnerships with IC and semiconductor manufacturing equipment vendors
worldwide. Boin GmbH has already established relationships to clients such
as Infineon, KLA-Tencor, Philips, Sopra, Mattson, Varian, Wacker Siltronic,
Carl Zeiss, LSI Logic and others.
Since April of 1999, Hologenix Inc. has been distributing our main product
WAFERMAP in the US and Canada. In August, 1999 we announced the expansion of
our global distribution network for WAFERMAP. The product is now directly
marketed and sold in Germany, France, Switzerland, UK and other European
countries by the J. P. Kummer group. In Japan, our products are distributed by
the Science Systems Sales division of Sumisho Electronics Co., Ltd. In
April of 2000, Nanyang Equipment Pte. Ltd. was selected as the exclusive
distributor in ASEAN, China, India and Taiwan. Altsoft Inc. is distributing our products in Korea.
Address: Boin GmbH, Haldenweg 25, 89160 Tomerdingen, Germany
Tel +49 (0) 7348 928233
Fax +49 (0) 7348 928234
Angaben entsprechend § 6 Gesetz über die Nutzung von Telediensten (Teledienstegesetz -TDG):
Firma: Boin GmbH
89160 Dornstadt OT Tomerdingen
Telefonnummer: 07348 928233
E-mail Adresse: email@example.com
Registergericht Ulm HRB 3660
USt-ID-Nr. DE 812 494 843