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Boin Receives Order for Multiple WAFERMAP Software Licenses from Foothill Instruments

Boin GmbH, a metrology software manufacturer for the semiconductor industry, announces the order of multiple WAFERMAP software licenses from Foothill Instruments, LLC, a
manufacturer of film and wafer thickness metrology systems. Foothill Instruments and Boin have operated under an OEM agreement since 1999...
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PANELMAP 1.1 released
It is a software package used to collect, edit, analyze and visualize measured physical parameters on rectangular semiconductor structures as LCD, TFT, solar or other panels.
Revision History >>
Download PANELMAP 1.1 >>
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WAFERMAP 2.14 released
Import:
Two new metrology tools are supported now
- Rigaku
- Philips AMS
Revision History >>
Download WAFERMAP 2.14 >>
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WAFERView.OCX 2.0 released
It is a software development kit for metrology equipment manufacturers. It offers 9 different types of graphics of WAFERMAP for Windows as an ActiveX control.
Revision History >>
Download WAFERView.OCX 2.0 >>
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