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Boin Receives Order for Multiple WAFERMAP Software Licenses from Foothill Instruments
 Boin GmbH, a metrology software manufacturer for the semiconductor industry, announces the order of multiple WAFERMAP software licenses from Foothill Instruments, LLC, a manufacturer of film and wafer thickness metrology systems. Foothill Instruments and Boin have operated under an OEM agreement since 1999... Read more >> |
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PANELMAP 1.1 released It is a software package used to collect, edit, analyze and visualize measured physical parameters on rectangular semiconductor structures as LCD, TFT, solar or other panels. Revision History >> Download PANELMAP 1.1 >> |
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WAFERMAP 2.14 released Import: Two new metrology tools are supported now - Rigaku - Philips AMS Revision History >> Download WAFERMAP 2.14 >> |
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WAFERView.OCX 2.0 released It is a software development kit for metrology equipment manufacturers. It offers 9 different types of graphics of WAFERMAP for Windows as an ActiveX control. Revision History >> Download WAFERView.OCX 2.0 >> |
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Help us improve Send us information on the data file format of your metrology equipment and earn a US $ 100 Reward! More >> |
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Home Page: http://www.boin-gmbh.com |
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