General

- Advanced xml-based Boin multi-column multi-wafer file format
- Loading of multiple columns and wafers at once
- Configurable 1D- (line scan), 2D- (contour or colored), and value plots
- Configurable 3D- (solid or wire frame), 3D bar chart, and sigma range plots
- Statistical analysis (histogram, calculation of mean, standard deviation, max, min, etc.)
- Import functions for data from metrology tools (e.g. 4 Dimensions, AIT CMS, AMS SRD/MRD, CDE ResMap, FILMetrics, KLA Tencor RS 100, KLA Tencor F5 Ellipsometer, Nanophotonics, Napson WS300, Nicolet, Plasmos, Prometrix Rs, Prometrix UV-1250, QC Solutions, Rigaku, Rudolph, Rudolph Metapulse, Semitek, Sentech, SOPRA SE, OMS, OMT, Thermawave Optiprobe and Thermaprobe, TWIN)
- Import of data from metrology tools which directly write WAFERMAP format (e.g. E & H, Foothill, Hypernex, ISIS Optronics, Jenoptik, Jobin Yvon, Sigmatech, Tepla)
- Other import functions (e.g. ASCII files, OPUS)
- Definition of any site pattern using a graphic editor
- Automatic generation of circular or Cartesian site patterns for any test diameter
- Extensive on-line help and HTML based user manual

SPC

- Trend charts
- Trend lists
- Global Statistics ("All points, all wafers")
- Browser
- Trend charts and lists can be sorted by any criterion (date & time, mean, max, min, std.dev. etc.)
- Calculation of Stacked Maps
- Operations with files
- Direct import of measurement files into the SPC tool

Operations

- Global operations (add, subtract, divide, square, square root, etc.)
- 1st and 2nd derivative of a map
- File compare operations (add, multiply, ratio, average etc.)
- File operations are applicable to files with different site distributions
- Shift (X and Y direction) and rotation of grids
- Mirroring of maps along the X and Y axis
- Averaging of radial zones
- Multiple files can be open simultaneously
- Multiple views of a single file can be selected and displayed simultaneously
- Multiple views can be printed on a single sheet, printouts are configurable including company logo
- Transformation of grids (Cartesian, circular) keeping same measurement feature
- Merge data of different files (e.g. two measurements of one wafer)
- Sigma Sorting Filter (1, 2, 3 sigma)
- Interpolation of sites

Communication/ Linking

- Inter-application communication via DCOM (ActiveX server)
- Advanced control of WAFERMAP can be achieved via DDE linking to another application
 


Copyright 1997-2013 by Boin GmbH
Home Page: http://www.boin-gmbh.com