Boin Endorses yieldPower Semiconductor Software
Tomerdingen (Germany) - For immediate release -
January 7, 2004
Boin GmbH, a software manufacturer for the semiconductor industry, announced that it has partnered with yieldPower Semiconductor Software to extend the breadth of test data analysis functionality offered to Semiconductor Engineers.
Boin has been providing WAFERMAP, Boin's software for analyzing and visualizing of data files from metrology tools used in wafer fabs, for the past 5 years and has over 100 customers worldwide. yieldPower extends WAFERMAP’s capabilities as an important tool for IC and wafer manufacturers, as well as semiconductor design and test engineers.
According to Dr. Manuela Boin, co-founder and General Manager of Boin GmbH, "The alliance with yieldPower extends WAFERMAP´s position as the premier tool to analyze and visualize semiconductor data in wafer fabrication and testing."
Omar Malik, Chief Executive Officer of yieldPower Semiconductor explained, "yieldPower Semiconductor Software enables test and product engineers to perform fast characterization and yield analysis, gives them the tool to monitor production data and maximize yield. Our software allows test engineers to drill down into Die Level results, and do wafer map comparisons by quartiles to judge defects. Our alliance with WAFERMAP will strengthen the breadth of functionality we can offer our clients.”
yieldPower is a software used to do statistical test data analysis on lot data from semiconductor IC production. yieldPower support standard test data formats such as STDF and ATDF, and imports data into its database (desktop and enterprise versions supported), and performs statistical calculations such as mean, sigma, cp, Cpk, etc. Users can chart wafer data by wafer maps, IQR wafer mapping, multi-lot histograms, and other useful charts. All reports are HTML based, and can be emailed to colleagues or uploaded to the web for open distribution. Among Fabless Semiconductor companies, yieldPower is used throughout the product process, from characterization to test reporting, and is the most valuable tool for Fabless Semiconductor companies. yieldPower software is in use at several of the largest Semiconductor companies, as well as Fabless Semiconductor companies.
WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
Boin's WAFERMAP software is already in use on a worldwide basis at a variety of IC and semiconductor equipment companies as well as wafer suppliers and research institutes. Among IC manufacturers, the software is used during production of analog, mixed-signal, DRAM and other integrated circuits including microprocessors and communications chips for the computer and telecommunications industries. It is used for
production and testing of both silicon (Si) and gallium arsenide (GaAs) integrated circuits. For further information, visit www.boin-gmbh.com.
yieldPower Semiconductor provides software solutions to the semiconductor and fabless semiconductor sectors. Headquartered in Dallas, Texas, yieldPower operations extend to key locations in North America, Europe, and Asia. yieldPower tools are instrumental in increasing the time to market and the efficiency of test engineers, and reducing their reporting time. For further information, visit www.yieldpower.com
Boin GmbH, Dr. Manuela Boin,
Tel: +49 (0) 7348-928233,
Fax: +49 (0) 7348-928234.
yieldPower, Omar M. Malik
Tel: +1 972-541-0302
Fax: +1 214-292-9674