TePla AG and Boin GmbH Sign OEM Agreement

Tomerdingen (Germany) - For immediate release -
February 12, 2001

TePla AG, a manufacturer of metrology tools as well as low pressure plasma systems, and Boin GmbH, a metrology software manufacturer for the semiconductor industry have signed an OEM agreement. Under the agreement TePla will use Boin´s WAFERMAP metrology software on it´s TWIN SC measurement tool to support the visualization and interpretation of measurement results.

WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram. Several kind of of operations can be applied to the wafer maps such as rotation, shifting of the grid in the X or Y direction, or mirroring the data along the X or Y axis. It is also possible to compare different sets of data by adding, subtracting or dividing entire wafer maps. Maps can be exported to ASCII data files.

The TWIN SC is an automated photothermal measurement tool to evaluate ion implantation in semiconductor industry as well as film thickness. Using a focused laser beam it works touchless and without any destruction. It is suitable for measurement on product wafers. TWIN SC provides measurements of high sensitivity, especially in the low dose range.

Dr.Manuela Boin, co-founder and General Manager of Boin GmbH said: "We are very proud to announce the cooperation with TePla AG. We are now close to the 10th customer milestone for OEM usage of WAFERMAP on metrology tools within the semiconductor industry. Our decision in early 1999 to focus on this market segment has been proven successful. We are discussing OEM licensing agreements with a number of other metrology equipment manufacturers in the US, Europe and Asia. Our goal is to set the standard for visualization of metrology data within the industry".

A free Evaluation Copy of WAFERMAP can be downloaded from www.boin-gmbh.com.

Contact:

Boin GmbH, Dr. Manuela Boin,
E-Mail: info@boin-gmbh.com,
www.boin-gmbh.com,
Tel: +49 (0) 7348-928233,
Fax: +49 (0) 7348-928234.

About TePla AG:
TePla AG develops and produces metrology tools and low pressure plasma systems for industrial and R + D applications. TePla is technological leader in the low pressure plasma technology sector. Our equipments are sold worldwide in close cooperation with our regional distributors. Subsidiaries have been found in Carrollton/Texas (USA) in 1999 and in Saint Quentin en Yvelines (near Paris/ France) in June 2000. To expand the sector Industrial/Medical TePla acquired in September 2000 the US-enterprise MetroLine Industries in Corona/California (USA). Since June 1999 the TePla AG is traded on the German "Neuer Markt".

TePla manufactures high quality standard machines and custom systems in compliance with today's strict requirements for safety, environmental protection and user-friendliness. Our product line ranges from small laboratory and pilot plant machines to industrial scale systems. In product development and problem solving we work closely with our customers to meet their current needs and to develop long term business relationships.

Contact:
TePla AG
Hans-Riedl-Str. 5
D-85622 Feldkirchen
Germany
e-mail: tepla@tepla.com
www.tepla.com
Tel: ++49 / 89 90503-0
Fax: ++49 / 89 90503-100

 

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