Boin Ships WAFERMAP 2.3 Software Site License to Mattson Thermal Products GmbH
Tomerdingen (Germany) - For immediate release -
November 10, 2004
Boin GmbH, a software manufacturer for the semiconductor industry, announces the shipment of WAFERMAP 2.3 Professional software site license to Mattson Thermal Products GmbH.
A site license allows for an unlimited number of WAFERMAP users at one location.
WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram. Several kind of of operations can be applied to the wafer maps such as rotation, shifting of the grid in the X or Y direction, or mirroring the data along the X or Y axis. It is also possible to compare different sets of data by adding, subtracting or dividing entire wafer maps. Maps can be exported to ASCII data files.
Mattson is a global innovator of rapid thermal processing (RTP) and dry strip solutions essential to front-end fabrication of current-generation integrated circuits (ICs). For further information, visit www.mattson.com
Boin's WAFERMAP software is already in use on a worldwide basis at a variety of IC and semiconductor equipment companies as well as wafer suppliers and research institutes. Among IC manufacturers, the software is used during production of analog, mixed-signal, DRAM and other integrated circuits including microprocessors and communications chips for the computer and telecommunications industries. For further information, visit www.boin-gmbh.com
Boin GmbH, Dr. Manuela Boin,
Tel: +49 (0) 7348-928233,
Fax: +49 (0) 7348-928234.