Boin GmbH releases new software development kit for metrology equipment manufacturers

Tomerdingen (Germany) - For immediate release -
March 1, 2001

Boin GmbH, a metrology software manufacturer for the semiconductor industry, has released a new software development kit for metrology equipment manufacturers. WAFERMAP-View.OCX for Win95/NT is a software development kit for both the semiconductor and disk drive industry. It offers the 7 different types of graphics of WAFERMAP for Win95/ NT as an ActiveX control. WAFERMAP-View.OCX employs an innovative object oriented visual programming interface to create and modify wafer plots. It was developed to satisfy the analysis and visualization needs of metrology equipment manufacturers.

WAFERMAP-View.OCX allows software developpers to use Boin´s innovative techniques to develop their own data analysis and visualization tools. 1D, 2D, and 3D graphs and histograms can easily be integrated into existing applications. The product complies to ActiveX standard and has an easy to use programming interface. Example source codes in Visual Basic as well as an on line help are available.

OEM customers can benefit from WAFERMAP-View.OCX by quick and easy integration into metrology applications and therefore save development time and costs. Through its high quality data visualization WAFERMAP-View.OCX is the perfect solution for ellipsometers, four point probes and others.

A free Evaluation Copy of WAFERMAP-View.OCX can be downloaded from www.boin-gmbh.com.

Contact:

Boin GmbH, Dr. Manuela Boin,
E-Mail: info@boin-gmbh.com,
www.boin-gmbh.com,
Tel: +49 (0) 7348-928233,
Fax: +49 (0) 7348-928234.

 

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