"New Methods of Metrology Data Analysis During Semiconductor Processing and Application to Rapid Thermal Processing"   Dr. Manuela Boin, Boin GmbH, Dr. Wilfried Lerch, STEAG AST Elektronik GmbH EMRS Spring Meeting, Symposium I (Rapid Thermal Processing), June 16-19, 1998, Strasbourg, France. If you want to receive a reprint please send us an email.   "Application of Metrology Data Processing and Analysis to Rapid Thermal Processing"   Dr. Manuela Boin, Boin GmbH, Dr. Wilfried Lerch, STEAG AST Elektronik GmbH Presented at 6th International Conference on Advanced Thermal Processing of Semiconductors, RTP'98, September 9-11, 1998, Kyoto, Japan. If you want to receive a reprint please send us an email.   Copyright © 1997-2010 by Boin GmbH Home Page: http://www.boin-gmbh.com