Links to semiconductor, integrated circuit, microchip, ic, silicon websites.    Download Wafermap
  What's new  Search this site  Sitemap        Add URL  Advertise here  Link to us  

Semiconductor Manufacturers: Irvine Sensors

You are here: Semiconductor Links > Manufacturers > Semiconductors > I > Irvine Sensors




Hologenix

Download Wafermap

Advertisements



Events:

Semicon Taiwan 2009
September 30 -October 2, 2009, Taipei World Trade Center, Taiwan

Semicon Europa 2009
October 6-8, 2009, Messe Dresden Germany

PV Taiwan 2009
October 7-9 2009

Semicon Japan 2009
December 2 – December 4, 2009, Makuhari Messe, Chiba, Japan

Semicon Russia 2010
June 14 -16, 2010, World Trade Center, Moscow, Russia


Irvine Sensors

URL: http://www.irvine-sensors.com
Location: USA

Products

HIGH DENSITY ELECTRONICS SOLUTIONS

-Stacked BGA Products

  • Accommodates virtually any BGA package stacked within the same outline and footprint
  • Memory Types: DDR, DDRII, FLASH, RLDRAMII, Mobile SDRAM - 3D stacked (2 to 4 layers)
  • Applications - Server, Portable Electronics, Cell Phone, Notebooks, Digital TV, Wireless, SSR, and Single Board Computers

    -Stacked TSOP Products

  • Economical and accommodates virtually any TSOP
  • 3D stacked (2 to 8 layers)
  • Applications - Server, Portable Electronics, VME Card, SODIMM, Memory Modules and Solid State Data Recorder (SSR)

    -Neo-StackTM Technology
    For Custom Applications

  • Accommodates a variety of different chips stacked (4 to 50 layers)
  • Heterogeneous Stack (FLASH, DRAM, ASIC, SRAM)
  • Applications - Portable Electronics, Cell Phone, Embedded Systems, Military, Space, Avionics, Wearable Computer

    -Stacked Bare Die Technology
    For Custom Applications

  • Memory Types: DDR, DDRII, FLASH, RLDRAMII-3D stacked (2 to 64 layers) within the single die footprint
  • Applications - Cell Phone, Mobile Computing, SODIMM, Military and Space MCM

    Image Processing

    -VIP/Balboa Image Processing Board

  • Balboa Architecture 320 MB/s, 64MB 20 SHARC™ Processors
  • Single width, 6U Board
  • VME/RACEway™/Link Port I/O
  • Direct Video I/O (RS170, RS422
  • IPCE™ processing to 1 Tera-Op
  • DSP acceleration for large data sets: images, SAR, sonar, and geophysics
  • Cost-effective solution for both new systems and legacy system upgrades
  • Bundled RedHawk Vision software

    -3DANN

  • Stacked IC module and interface electronics
  • Ultra-High Speed - 1012 Ops for accelerating convolution computations
  • Module contains 64 identical layers of custom analog processing ASICs that compute the inner product of an image vector and a weight (kernal) vector
  • 5-10 Watts power dissipation
  • Module size: (.5 x .5 x .5) inch3

     Related Links 






     Sponsor Links 
    Car Safety Guide
    Your Guide to Car and Vehicle Safety on the Web

    SemiDir
    The Web Directory for Semiconductor Equipment and Materials.

    Search Engine Articles
    Articles about Internet search engines. These articles offer some advice on how to improve visibility on major search engines.
    Semiconductor News


    Semiconductor Manufacturing
    Your Guide to Semiconductor Manufacturing on the Web

    Kids-and-Science.de (german)
    Science for Kids and Parents

    Your link here!   




     Search the Web with Google 
    Google


     Link to this page and get a link back 

    Web Pages referring to this page
    Link to this page and get a link back!





  • Page created: October 1, 1997
    Last modification: August 14, 2009


    Copyright © 1997,98, 99, 2000, 01, 02, 03, 04, 05, 06, 07, 08, 09 by Boin GmbH - Metrology Software for the Semiconductor Industry. All rights reserved.
    Trademarks are the property of their respective owners.
    Disclaimer