Events:
Semicon Taiwan 2009
September 30 -October 2, 2009, Taipei World Trade Center, Taiwan
Semicon Europa 2009
October 6-8, 2009, Messe Dresden Germany
PV Taiwan 2009
October 7-9 2009
Semicon Japan 2009
December 2 – December 4, 2009, Makuhari Messe, Chiba, Japan
Semicon Russia 2010
June 14 -16, 2010, World Trade Center, Moscow, Russia
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Irvine Sensors
URL: http://www.irvine-sensors.com
Location: USA
Products
HIGH DENSITY ELECTRONICS SOLUTIONS
-Stacked BGA Products
Accommodates virtually any BGA package stacked within the same outline and footprint
Memory Types: DDR, DDRII, FLASH, RLDRAMII, Mobile SDRAM - 3D stacked (2 to 4 layers)
Applications - Server, Portable Electronics, Cell Phone, Notebooks, Digital TV, Wireless, SSR, and Single Board Computers
-Stacked TSOP Products
Economical and accommodates virtually any TSOP
3D stacked (2 to 8 layers)
Applications - Server, Portable Electronics, VME Card, SODIMM, Memory Modules and Solid State Data Recorder (SSR)
-Neo-StackTM Technology
For Custom Applications
Accommodates a variety of different chips stacked (4 to 50 layers)
Heterogeneous Stack (FLASH, DRAM, ASIC, SRAM)
Applications - Portable Electronics, Cell Phone, Embedded Systems, Military, Space, Avionics, Wearable Computer
-Stacked Bare Die Technology
For Custom Applications
Memory Types: DDR, DDRII, FLASH, RLDRAMII-3D stacked (2 to 64 layers) within the single die footprint
Applications - Cell Phone, Mobile Computing, SODIMM, Military and Space MCM
Image Processing
-VIP/Balboa Image Processing Board
Balboa Architecture 320 MB/s, 64MB 20 SHARC™ Processors
Single width, 6U Board
VME/RACEway™/Link Port I/O
Direct Video I/O (RS170, RS422
IPCE™ processing to 1 Tera-Op
DSP acceleration for large data sets: images, SAR, sonar, and geophysics
Cost-effective solution for both new systems and legacy system upgrades
Bundled RedHawk Vision software
-3DANN
Stacked IC module and interface electronics
Ultra-High Speed - 1012 Ops for accelerating convolution computations
Module contains 64 identical layers of custom analog processing ASICs that compute the inner product of an image vector and a weight (kernal) vector
5-10 Watts power dissipation
Module size: (.5 x .5 x .5) inch3
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